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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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9 Years

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Immersion TIN FR4 2L Electronic Circuit Design fr4 circuit board

Shenzhen Xinchenger Electronic Co.,Ltd

Immersion TIN FR4 2L Electronic Circuit Design fr4 circuit board

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Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : FR4

Layer : 4

Color : Green

Min line space : 4mil

Min line width : 4mil

Copper thickness : 1OZ

Board size : 86*86mm

Panel : 1

Surface : ENIG

Contact Now

Immersion TIN FR4 2L Electronic Circuit Design

Quick detail:

Origin:China Special: FR4 Material
Layer:4 Thickness:1.6mm
Surface: ENIG Hole:0.5

Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size: (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance: ±0.13
13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

Surface Finishes - Providing every surface finish you require.

White-Tin

Immersion Silver

Electroless Nickel - Immersion Gold (ENIG)

SMOBC (Soldermask Over Bare Copper)

HASL (Hot Air Solder Level) 60/40 Tin/Lead

HAL (Hot Air Solder Level) Lead-Free

Nickel - Palladium - Gold (Ni/Pd/Au)

Deep Nickel - Gold (Hard)

OSP (Organic Solderbility Preservative)

Selective Gold with SMOBC/HASL

Selective Gold with Immersion Finishes

Why Choose Us?

1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM, we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information

Trade Terms:

1. Payment: T/T in advance (Western Union , PayPal is welcomed)

2. Sample can be delivered in 3 days

3. Shipping freight are quoted under your requests

4. Shipping port: Shen zhen,Mainland China

5. Discounts are offered based on order quantities

6. MOQ: 1PCS

Technology Capability

1. No of layer

2-18 layer rigid PCB and High frequency PCB

2. Material

FR-4, high frequency,etc

3. Special technology

Buried/blind via, impedance control, thick copper,high frequency, metal core, gold fingers, peelable mask, countersink hole, hole plug, etc

4. Surface finishing

HASL, immersion gold, immersion silver, immersion tin, OSP, ENEPIG

5. Product application

Telecommunications, industrial electronics, automotive, medical, Power supply, LED lighting, aerospace, etc


Product Tags:

pcb manufacturing process

      

fr4 circuit board

      
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