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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried

Shenzhen Xinchenger Electronic Co.,Ltd
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Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried

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Brand Name : XCE

Model Number : XCEP

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Model : XCEP

Origin : Shenzhen

Size : 9.5*10.5cm

Brand : XCE

Color : green

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Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried ​

Application:

Automobile

Backplanes

Servers and Networking

Telecommunications

Data Storage

Heavy Copper Application

Specification:

Base Material: fr4
Layer:2
Thickness: 1.0MM
Copper weight:2OZ
Surface finish: ENIG

High frequency:

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2

Specification:

Technology

Materials

  • Multilayer PCBs with 18 layers
  • Teflon

PCB thickness

Final copper

  • 2.6 mm
  • 1OZ

Conductor track widths

Minimum drilling diameter

  • ≥ 90 µm
  • 0.2 mm

Contour production

Solder masks

  • Milling
  • Scoring
  • Photosensitive solder mask systems
  • UV solder mask system, screen printing

Surfaces

Additional printing



  • Immersion gold
  • Identification printing, inkjet
  • Component printing, screen printing
  • Through-hole printing
  • Peelable solder mask (green mask)
  • Masking tape
  • Plugging









Layer

12-26

Material type

FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

Board thickness

0.21mm to 7.0mm

Copper thickness

0.5 OZ to 6 oz

Size

Max. Board Size: 580mm×1100mm

Min. Drilled Hole Size: 0.2 mm (8 mil)

Min. Line Width: 4mil (0.1mm)

Min. Line Spacing: 4mil (0.1mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin,
Immersion Silver/Gold, OSP, Gold plating

Solder Mask Color

Green/Yellow/Black/White/Red/Blue

Tolerance

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling


Why us ?

1)Professional engineer team --help you to check design and do engineering before production

2)Rich expierences in pcb production industry--provide high quality and competitive price pcb.

3) After-sales service--every problem you have will get our professional advice and solution.

4) Constant follow up-- make us have the fast reaction of your requirement.

5) Inspected by the Inspection Institution--ISO,UL,ROHS cerfiticated


Our PCB - Printed Circuit Board capabilities include:

  • One to Thirty Layers
  • Rigid Flex Circuit Board
  • One to Eight layer flexible PCB
  • Hybrid constructions PCB
  • Metal core (Aluminum)
  • PCB up to 6 oz inner layer
  • Finishes: HASL, HASL (Pb-free), Soft Bondable Gold, Electrolytic Gold, Immersion Gold, Immersion Silver, Immersion Tin, OSP.
  • Materials: Polyimide, Arlon, Nelco, Rogers, Getek, Polyclad
  • Impedance Control and Blink/Buried Vias, HDI, Microvias
  • RoHS Compliant (RoHS – Restrictions on the use Of Hazardous Substances)


Product Tags:

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